Samsung’s Big Bet: Aggressive 1c DRAM Expansion to Reclaim Market Leadership
- Brian D
- Dec 3, 2025
- 2 min read
Samsung Electronics is reportedly launching a massive production ramp-up for its next-generation memory, aiming to secure a monthly capacity of 200,000 wafers for its 1c (10nm-class, 6th generation) DRAM by the end of 2026. If achieved, this advanced node would account for approximately one-third of Samsung’s total DRAM output, signaling a decisive pivot to meet the insatiable global demand for AI-driven high-performance memory.
2026 is the Deadline
According to industry reports, Samsung has set a strict timeline to scale this technology. The plan targets an initial capacity of 60,000 wafers per month by the end of 2025, followed by an aggressive expansion in 2026—adding 80,000 wafers in the second quarter and another 60,000 in the fourth quarter. This rollout will be supported by upgrading existing lines at its Hwaseong campus and deploying new equipment at its massive Pyeongtaek P4 facility, which is poised to become a core hub for next-gen memory production.
Why 1c DRAM Matters
The shift to 1c DRAM is not just a routine upgrade; it is critical for Samsung’s survival in the high-end market. The 1c node (sub-11nm) features advanced Extreme Ultraviolet (EUV) layers and serves as the foundational "base die" for HBM4 (High Bandwidth Memory), the next standard for AI accelerators. By committing to such high volumes, Samsung is attempting to close the gap with rival SK Hynix, which has dominated the HBM market recently and is similarly ramping up its own 1c production to an estimated 160,000–190,000 wafers by 2026.
The Bottom Line
This move indicates that Samsung is betting on a "supercycle" for general-purpose DRAM (DDR5, LPDDR) alongside HBM. With AI inference servers demanding faster and more power-efficient memory, the industry is facing a potential supply crunch. Samsung’s strategy is to use its sheer manufacturing scale—converting older NAND and DRAM lines to this cutting-edge node—to flood the market with high-performance chips and potentially regain its undisputed status as the "Memory King."
Sources:
TrendForce: "[News] Samsung Reportedly Plans 200K 1c DRAM Wafers/Month by 2026, About One-Third of Its Total Output"
(November 19, 2025)
TechPowerUp: "Samsung Reallocates NAND Production to DRAM Across Korean Fabs"
(November 20, 2025)
Digitimes: "Samsung reportedly converts NAND lines to DRAM to meet surging AI memory demand"
November 24, 2025)
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